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IC PACKAGE DESIGNER (w/m)

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IC PACKAGE DESIGNER (w/m)

Join NanoXplore and help build Europe's critical technologies of tomorrow!

 

At NanoXplore, we design advanced FPGAs, SoC FPGAs, ASICs and data converters enabling some of Europe's most demanding space, defense, avionics and industrial applications.

As a fast-growing European deeptech company with more than 200 passionate engineers across France, we push the boundaries of high-reliability microelectronics every day.

 

Ready to make an impact? Join us and help shape the future of European technology as a:

 

IC PACKAGE DESIGNER (w/m)

 

Do you want to contribute to the design of next-generation integrated circuit packages and advanced semiconductor architectures?

Join NanoXplore as an IC Package Designer and take part in the development of high-performance, reliable, and innovative semiconductor solutions.

In this full-time role, you will be responsible for the structural and functional design of integrated circuit packages.

 

YOUR MISSION :

Design the graphical and structural components of integrated circuit packages;

Use computer-aided design (CAD) tools to produce reliable and high-performance designs;

Develop and analyze prototypes to validate design reliability and performance;

Write technical specifications and comprehensive documentation, serving as clear and actionable requirements for internal teams and external partners;

Manage and follow up on subcontractor work, ensuring compliance with expected quality levels, project requirements, and industry standards.

 

YOUR PROFILE :

Rigorous and detail-oriented, with a strong focus on reliability and quality;

Strong written communication skills for clear, actionable technical documentation;

At ease working with multidisciplinary teams and external partners;

Autonomous, organised, and proactive.

 

SKILLS & EXPERIENCE :

More than 5 years of experience in IC package design, or more than 10 years of experience in PCB design, including at least 3 years involving IC package design;

Hands-on experience in designing organic and ceramic BGA flip-chip substrates, including ball map definition, stack-up construction, routing, via and microvia design, as well as thermal and mechanical reliability analysis;

Practical experience with Cadence APD+, with a proven track record in designing complex high-density interconnect (HDI) substrates for state-of-the-art IC packaging applications;

In-depth knowledge of IPC standards, substrate materials, and manufacturing processes, with a solid understanding of how material properties impact electrical and thermal performance;

Experience in signal integrity simulations and IBIS/Touchstone model extraction, strongly preferred, with the ability to analyze and optimize electrical performance for high-speed interfaces (e.g. LPDDR5X, 12.5 Gbps NRZ, 112 Gbps PAM4);

Experience in power integrity simulations for multi-power-domain designs (up to 10 power domains);

Knowledge of chiplet-based design and heterogeneous integration, considered a strong asset, particularly in the context of advanced packaging architectures.

 

PRACTICAL INFORMATION

  • Contract type: Permanent (CDI)
  • Location: Jacou / Sèvres / Meylan / Caen
  • Package: salary according to profile + internal benefits
  • Start date: as soon as possible

 

If you're eager to push the boundaries of microelectronics and contribute to technologies that will shape the future, join us and become part of a team that is not only designing chips but also helping build Europe's technological independence for decades to come!

NanoXplore’s Careers website is intended solely for individuals seeking employment with NanoXplore.
Staffing and recruitment agencies, as well as candidates represented by an agency, are not authorized to use this site or to submit profiles, applications, or resumes without prior written approval from NanoXplore. Any unsolicited submissions will be considered unsolicited.
NanoXplore does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our job aliases, NanoXplore employees, or any other NanoXplore location.
NanoXplore is not responsible for any fees related to unsolicited resumes or applications.

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Embedded Systems

Bridging the gap between silicon and software, the Embedded Systems team designs the low-level tools that make NanoXplore’s FPGAs truly usable and powerful. 


Their core mission : developing the main SDK (Software Development Kit), firmware, and all embedded components that enable seamless configuration, control, and integration of our devices. From bootloaders and drivers to board support packages and diagnostic tools, they ensure our chips speak the right language whether on a satellite, in a defense system, or in a test environment. Their work is foundational : without it, nothing runs. 


What sets them apart is their ability to think system-wide. They work closely with hardware teams and application engineers, adapt to evolving specs, and support real-world use cases with reliability and reactivity. 

They’re not just writing code : they’re building the ecosystem around our FPGAs.


Driven by curiosity and precision, it’s a team where autonomy meets collaboration, and where each line of code contributes to something bigger : making advanced microelectronics accessible and operational for the most demanding applications.

Check our open positions