Ultra300
Radiation Hardened COTS
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Ultra300 COTS is the commercial version of NanoXplore’s second-generation FPGA family. It shares the same programmable architecture as the radiation-hardened ULTRA 300 devices, including 4-input Look-up Tables with LUT extenders, configurable DFF, Coarse Grain Blocks, embedded memories, and dedicated DSP units. Optimized for industrial and automotive applications, ULTRA 300 COTS combines high logic density, scalability, and performance for cost-sensitive markets.
Security
Embedded protection by design, for mission-critical confidence
Reliability
Proven resilience for the harshest environments, from orbit to the edge
Performance
Scalable performance and flexibility to meet all your system’s needs
Technical specifications
Detailled specifications to ensure optimal performance in every environment
| Device | NX2H300TSA |
|---|---|
| Capacity | |
| - ASIC Gates | 4 000 000 |
| Logic Modules | |
| - Register | 273 408 |
| - LUT-4 | 290 496 |
| - Carry | 68 352 |
| Embedded RAM | 22Mb |
| - DPRAM | 21504 |
| - Core Register File | 1424 |
| Clocks / PLL | 50/7 |
| Additional Features | |
| - SpaceWire PHY (8 IOBs) | 20 |
| - DDR3/4 PHY (11 IOBs) | 20 |
| - Embeded DSP | 896 |
| - DSP Blocks | 1 |
| - SpaceWire link I/F 400Mbps | 16 |
| - SERDES Tx/Rx 12,5Gbps | |
| - Hard IP Processor core / SoC | NO |
| - ADC / DAC | 4 / 4 |
| Design Security | YES |
| Inputs / Outputs | |
| - Complex I/O bank | 10x 34 I/Os |
| - Simple I/O bank | 1x 16 I/Os + 6x 24 I/Os |
| Packages - User I/Os | 500 I/Os |
| - BGA484 27*27mm / 1mm HSSL 12,5 Gbps, SERDES TX/RX User IOs | 4 239 |
| - BGA1152 35*35mm / 1mm HSSL 12,5 Gbps, SERDES TX/RX User IOs | 16 500 |
Radiation Tolerance
Radiation hardening by design in configuration memories and registers.
SEU immune up to LET > 60MeV.cm2/mg.
Total ionizing dose > 50Krads (Si).
Embedded EDAC for user memory mitigation.
Embedded configuration memory scrubbing.
Fast automatic memory configuration repair.
Embedded bitstream integrity check (CMIC).
Main Features
28 nm STMFDSOI process technology.
12-bit ADC, 13-bit DAC
4-Input Look-up tables.
LUT expender to support up to 16 bits boolean functions.
High performance carry chains.
Advanced interconnect network to support random logic and coarse grain block functions.
DSP Blocks for complex arithmetic operations.
User memories with variable width and depth.
Configuration modes: JTAG, Parallel 16 bits, Master Serial SPI, SpaceWire, Flash and UART.
Integrated Space Wire interface available for user applications.
Dedicated lowskew distribution network for clock, reset and load enable signals.
On-chip thermal sensor.
Input / Output Features
Multi voltage I/O support from 1.2V to 3.3V
Cold sparing support.
Programmable output drive to support multiple industry standards.
Embedded logic to support DDR2, DDR3 and DDR4.
Up to 1.6 Gbps maximum I/O support for SSTL, HSTL and POD standards.
LVDS compatible mode.
All pins support 2000V of ESD-HBM.
Embedded logic to support Space Wire Data Strobe encoding.
Programmable delay lines on complex I/O pins.
Programmable resistive termination on complex I/O pins.
Documentation
Guiding your project from concept to long term success
For a complete library of user guides, reference manuals and technical documentation,
or if you have an questions about our products, head to our Wiki Page.
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