NG-Medium
FPGAs Radiation Hardened
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NG-Medium is the first Radiation Hardened by Design (RHBD) SRAM-based FPGA developed by NanoXplore. The programmable matrix is built on an interconnect architecture made of 4-input Look-up tables, DFF, 48K-bits RAM, Carry and 19x24 multipliers in a Digital Signal Processing units offering a high logic density.
Safety
Embedded protection by design, for mission-critical confidence
Reliability
Proven resilience for the harshest environments, from orbit to the edge
Performance
Scalable performance and
flexibility to meet the most demanding applications
Technical specifications
Detailled specifications to ensure optimal performance in every environment
| Device | NX1H35S |
|---|---|
| Capacity | |
| - ASIC Gates | 550 000 |
| - Logic Modules | |
| - Register | 32 256 |
| - LUT-4 | 34 272 |
| - Carry | 8 064 |
| Embedded RAM | 2,856Mb |
| - DPRAM | 2,688K |
| - Core Register File | 168 |
| - Core Register File Bits | 168K with ECC |
| Clocks | 24 |
| Additional Features | |
| - SpaceWire link PHY (8 IOBs) | 16 |
| - DDR2 PHY (11 IOBs) | 16 |
| - DSP Blocks | 112 |
| - SpaceWire link I/F 400Mbps | 1 |
| Inputs / Outputs I/O banks | 13 |
| Packages - User I/Os | |
| - LG625 | 374 |
| - CQ352 | 192 |
Radiation Tolerance
Radiation hardening by design in configuration memories and registers.
SEL immune up to LET > 60MeV.cm2/mg.
Device Configuration SER < 1.70 10-4 /day (GEO)
Total ionizing dose > 100Krads.
Embedded EDAC for user memory mitigation.
Embedded bitstream integrity check (CMIC).
Main Features
65 nm STm C65-SPACE process technology.
4-Input Look-up tables.
High performance carry chains.
Advanced interconnect network to support random logic and coarse grain block functions.
DSP Blocks for complex arithmetic operations.
User memories with variable width and depth.
5 configuration modes: JTAG, Parallel 8 bits, Parallel 16 bits, Space Wire.
Integrated Space Wire interface available for user applications.
Dedicated lowskew distribution network for clock, reset and load enable signals.
On-chip thermal monitoring capability.
Input / Output Features
Multiple I/O powering support from 1.8V to 3.3V
Cold sparing support.
Programmable output drive to support multiple industry standards.
Embedded logic to support DDR2 and DDR3.
800 Mbps I/O support.
LVDS compatible mode.
All pins support 2000V of ESD-HBM.
Embedded logic to support Space Wire Data Strobe encoding.
Programmable delay lines on all pins.
Programmable resistive termination.
Documentation
Guiding your project from concept to long term success
For a complete library of user guides, reference manuals and technical documentation,
or if you have an questions about our products, head to our Wiki Page.
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